Power chips are linked to exterior circuits with packaging, and their efficiency depends upon the support of the product packaging. In high-power situations, power chips are generally packaged as power components. Chip interconnection refers to the electric link on the upper surface area of the chip, which is typically aluminum bonding cord in standard components. ^
Typical power component plan cross-section
Presently, business silicon carbide power components still mainly make use of the packaging modern technology of this wire-bonded typical silicon IGBT component. They deal with issues such as big high-frequency parasitic parameters, insufficient heat dissipation ability, low-temperature resistance, and not enough insulation strength, which limit making use of silicon carbide semiconductors. The display screen of excellent performance. In order to resolve these issues and fully manipulate the massive possible benefits of silicon carbide chips, many new packaging technologies and options for silicon carbide power modules have actually arised over the last few years.
Silicon carbide power component bonding approach
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have actually created from gold cord bonding in 2001 to light weight aluminum wire (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have actually established from gold wires to copper cords, and the driving pressure is expense reduction; high-power devices have actually created from aluminum cords (strips) to Cu Clips, and the driving pressure is to improve item efficiency. The greater the power, the greater the needs.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that utilizes a strong copper bridge soldered to solder to connect chips and pins. Compared with traditional bonding packaging methods, Cu Clip innovation has the complying with benefits:
1. The link in between the chip and the pins is made from copper sheets, which, to a certain degree, changes the conventional cord bonding technique between the chip and the pins. For that reason, a special bundle resistance worth, higher present circulation, and much better thermal conductivity can be acquired.
2. The lead pin welding location does not require to be silver-plated, which can completely conserve the price of silver plating and poor silver plating.
3. The product appearance is entirely consistent with normal products and is primarily made use of in servers, mobile computer systems, batteries/drives, graphics cards, electric motors, power products, and other areas.
Cu Clip has two bonding methods.
All copper sheet bonding method
Both eviction pad and the Source pad are clip-based. This bonding method is a lot more pricey and intricate, however it can attain better Rdson and much better thermal impacts.
( copper strip)
Copper sheet plus cable bonding technique
The source pad utilizes a Clip approach, and the Gate uses a Cable approach. This bonding method is a little less expensive than the all-copper bonding method, conserving wafer location (relevant to really tiny gateway areas). The procedure is simpler than the all-copper bonding approach and can acquire far better Rdson and much better thermal result.
Supplier of Copper Strip
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